RELENTLESS PICK-AND-PLACE & DISPENSING
Introducing – The Puma – State of the art technology. Expandable in any direction. Same as in nature our Puma is common modular and adaptive in all kinds of environment. With different modules the systems grow synchronously with the customer’s requirements for performance and processes. Puma is world`s best highspeed Pick-and-Place solution which can also be used in ultraflexible, rapid prototyping development.
combined process
- Highspeed placing and dispensing in single pass-through
- 1, 2 or 4 placement-axes and 1-2 dispense processes
productivity
- Optimum 30’000 cph, up to 90’000 cph in line
- Valve performance 780’000 - System Ø 310’000 dots/h
small footprint
- Up to 280 Feeder on 2 m2 (up to 420 in line)
- PCB size 560 x 610 mm, optional 1’800 x 610 mm
mineral cast
- No vibration, symmetrical mineral casting
- No warpage, no thermal drift
quick changeover
- Nonstop production, intelligent smart feeder
- Nonstop feeder and production changeover
linear motors
- Fast, reliable double drive linear motors
- No maintenance, longest lifetime
| Puma4 | Puma2 | Puma | ||
|---|---|---|---|---|
| Productivity | Optimum placement speed | 18’100 cph (4-axes) | 11’200 cph (2-axes) | 6’700 cph (1-axis) |
| Optimum jetting speed | - | 145‘000 Dots/h | - | |
| Feeder | Feeder capacity 8 mm Tape | 280 (160 inline) | 260 (140 inline) | 260 (140 inline) |
| Components | Component size range | 008004 (imp.) - 80 x 80 mm | (Note specs for constraints) | |
| Accuracy | Placement accuracy (x, y) | Chip ± 40 μm (3σ) / QFP ± 30 μm (3σ) | ||
| PCB | Max. PCB dimensions | 560 x 610 mm (22 x 24“) | optional 1’800 x 610 mm (71 x 24“) | |
| Dimensions | Machine footprint | 1’557 x 1’357 mm (61 x 53“) |
Valves and Pumps
| Piezo Jet | Shockwave Jet | Volume | Screw | Time-Pressure |
|---|---|---|---|---|
| SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Dielectric Ink |
Solder Paste, Liquid Metal |
Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste |
Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill |
Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill |
| Low - High Viscosity | High Viscosity | Low - High Viscosity | High Viscosity | High Viscosity |
| Max Frequency: 2'000'000 dots/h BGA Jet-on-the-Fly: 780'000 dots/h BGA Stop & Jet: 177'000 dots/h |
Max Frequency: 780'000 dots/h BGA Jet-on-the-Fly: 480'000 dots/h Average Speed: 310'000 dots/h |
26'000 dots/h (BGA Pattern*) |
30'000 dots/h (BGA Pattern*) |
38'000 dots/h (BGA Pattern*) |
* Full Speed: Dot size 0.5 mm, dot matrix 0.8 x 0.8 mm, 1000 dots, medium: Loctite 3621
