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RELENTLESS ALL-TERRAIN DISPENSER

Introducing – The Tarantula – State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.

dispense technology

process control

productivity

large dispense area

mineral cast

height mapping

linear motors

Tarantula
Process Maximum dispensing speed Piezo Jet Valve: 145‘000 dots/h
Dynamic Shockwave Valve: 77‘000 Dots/h
Time/Pressure Valve: 26‘000 Dots/h
Archimedean Screw Valve: 22‘000 Dots/h
Dispensing mode Dot, line, curve, interpolated 3D contour
Accuracy Placement XY dots ±40 μm (3σ)
Positioning Z axis ±20 μm (3σ)
PCB PCB dimensions 560 x 610 mm (22 x 24“)
Dimensions Machine footprint 1’557 x 1’357 mm (61 x 53“)

Valves and Pumps

Tabla de Datos
Piezo Jet Shockwave Jet Volume Screw Time-Pressure
SMD-Adhesives, Underfill,
Silver Epoxy, UV-Adhesives,
Globe Top, Encapsulation,
Dielectric Ink
Solder Paste,
Liquid Metal
Underfill, Gasketing,
Globe Top, Dam and Fill,
Solder Paste
Solder Paste, SMD-Adhesive,
Globe Top, Encapsulation,
Silver Epoxy, Dam and Fill
Gasketing, Globe Top,
Encapsulation, Solder Paste,
SMD-Adhesive, Silver Epoxy,
Dam and Fill
Low - High Viscosity High Viscosity Low - High Viscosity High Viscosity High Viscosity
Max Frequency: 2'000'000 dots/h
BGA Jet-on-the-Fly: 780'000 dots/h
BGA Stop & Jet: 177'000 dots/h
Max Frequency: 780'000 dots/h
BGA Jet-on-the-Fly: 480'000 dots/h
Average Speed: 310'000 dots/h
26'000 dots/h
(BGA Pattern*)
30'000 dots/h
(BGA Pattern*)
38'000 dots/h
(BGA Pattern*)

* Full Speed: Dot size 0.5 mm, dot matrix 0.8 x 0.8 mm, 1000 dots, medium: Loctite 3621

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